Patent Assignment
Reel/Frame 060238/0392
Assignment of Assignor's Interest
Recorded: 2022-06-17
Pages: 9
Assignors
VADHAVKAR, SAMEER SUNIL
Executed: 2022-05-16
YUN, CHANGHAN HOBIE
Executed: 2022-06-17
THADESAR, PARAGKUMAR AJAYBHAI
Executed: 2022-06-15
PARK, NOSUN
Executed: 2022-05-17
KIM, DANIEL DAEIK
Executed: 2022-06-15
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Die Edge Protection to Eliminate Die Chipping
Application:
17/661,029 →
Publication:
US 2023/0352423