Patent Assignment
Reel/Frame 060253/0847
Assignment of Assignor's Interest
Recorded: 2022-06-21
Pages: 12
Assignors
LEE, KUO-HSING
Executed: 2022-06-17
LIN, CHUN-HSIEN
Executed: 2022-06-17
CHIU, YUNG-CHEN
Executed: 2022-06-17
HSUEH, SHENG-YUAN
Executed: 2022-06-17
PAI, CHI-HORN
Executed: 2022-06-17
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same