Patent Assignment
Reel/Frame 060259/0119
Assignment of Assignor's Interest
Recorded: 2022-06-21
Pages: 4
Assignors
LIN, KAN-JU
Executed: 2022-06-14
HUANG, LIN-YU
Executed: 2022-06-14
LU, MIN-HSUAN
Executed: 2022-06-15
LOH, WEI-YIP
Executed: 2022-06-14
LEE, HONG-MAO
Executed: 2022-06-14
CHIEN, HARRY
Executed: 2022-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Buried Conductive Structure in Semiconductor Substrate