Patent Assignment
Reel/Frame 060259/0200
Assignment of Assignor's Interest
Recorded: 2022-06-21
Pages: 4
Assignors
VELLIANITIS, GEORGIOS
Executed: 2022-06-08
MADIA, ORESTE
Executed: 2022-06-08
DOORNBOS, GERBEN
Executed: 2022-06-08
VAN DAL, MARCUS JOHANNES HENRICUS
Executed: 2022-06-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Forming the Same