Patent Assignment
Reel/Frame 060277/0399
Assignment of Assignor's Interest
Recorded: 2022-06-22
Pages: 4
Assignors
SHIMIZU, DAISUKE
Executed: 2022-06-13
LING, LI
Executed: 2022-06-13
WATANABE, HIKARU
Executed: 2022-06-13
TAKESHITA, KENJI
Executed: 2022-06-15
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method and Apparatus for Etching a Semiconductor Substrate in a Plasma Etch Chamber