Patent Assignment
Reel/Frame 060278/0059
Assignment of Assignor's Interest
Recorded: 2022-06-22
Pages: 5
Assignors
CHU, CHEN-TE
Executed: 2022-05-25
HSIAO, YUAN-YANG
Executed: 2022-05-25
CHIU, CHIH-PIN
Executed: 2022-06-05
LAI, YING-YAO
Executed: 2022-06-05
WANG, MAO-NAN
Executed: 2022-05-26
HUANG, CHEN-CHIU
Executed: 2022-05-25
CHEN, DIAN-HAU
Executed: 2022-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packaging Structure and Method for Manufacturing the Same