Patent Assignment
Reel/Frame 060278/0704
Assignment of Assignor's Interest
Recorded: 2022-06-22
Pages: 4
Assignors
YAMAZAKI, RYOSUKE
Executed: 2021-02-08
OZAKI, KOUICHI
Executed: 2021-02-03
IMAIZUMI, TORU
Executed: 2021-02-03
Assignee
DOW TORAY CO., LTD.
2-24, HIGASHI SHINAGAWA 2-CHOME, SHINAGAWA-KU, TOKYO, 140-8617, JAPAN
Covered Property
(1)
Curable Hot-Melt Silicone Composition, Cured Material Thereof, and Laminate Containing Curable Hot-Melt Silicone Composition or Cured Material Thereof