Patent Assignment
Reel/Frame 060304/0325
Assignment of Assignor's Interest
Recorded: 2022-06-24
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods of Forming the Same
Application:
17/808,705 →
Publication:
US 2023/0420330