Patent Assignment
Reel/Frame 060307/0454
Assignment of Assignor's Interest
Recorded: 2022-06-24
Pages: 4
Assignors
LIN, KAN-JU
Executed: 2022-05-31
LIU, HAO-HENG
Executed: 2022-06-08
CHANG, CHIEN
Executed: 2022-05-31
HUANG, HUNG-YI
Executed: 2022-06-05
CHIEN, HARRY
Executed: 2022-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Conductive Structures and Methods of Forming the Same
Application:
17/805,605 →
Publication:
US 2023/0395429