Patent Assignment
Reel/Frame 060310/0633
Assignment of Assignor's Interest
Recorded: 2022-06-24
Pages: 10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnect Structure Having Different Dimensions for Connected Circuit Blocks in Integrated Circuit
Application:
17/849,345 →
Publication:
US 2023/0402375