Patent Assignment
Reel/Frame 060310/0923
Assignment of Assignor's Interest
Recorded: 2022-06-24
Pages: 3
Assignors
CHEN, WEN-YEN
Executed: 2022-06-13
HUANG, TSAI-YU
Executed: 2022-06-13
YEO, YEE-CHIA
Executed: 2022-06-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Thereof
Application:
17/849,424 →
Publication:
US 2023/0420563