Patent Assignment
Reel/Frame 060315/0014
Assignment of Assignor's Interest
Recorded: 2022-06-27
Pages: 4
Assignors
LI, HUNG-JU
Executed: 2022-06-20
CHANG, KUO-PIN
Executed: 2022-06-20
TING, YU-WEI
Executed: 2022-06-20
CHEN, YU-SHENG
Executed: 2022-06-20
CHEN, CHING-EN
Executed: 2022-06-26
HUANG, KUO-CHING
Executed: 2022-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Thermally Enhanced Selector Structure and Methods of Forming the Same
Application:
17/849,755 →
Publication:
US 2023/0422517