Patent Assignment
Reel/Frame 060315/0021
Assignment of Assignor's Interest
Recorded: 2022-06-27
Pages: 5
Assignors
LIN, DA-JUN
Executed: 2022-05-18
YEH, CHIH-TUNG
Executed: 2022-05-18
TSAI, FU-YU
Executed: 2022-05-18
TSAI, BIN-SIANG
Executed: 2022-05-18
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Manufacturing the Same