Patent Assignment
Reel/Frame 060339/0235
Assignment of Assignor's Interest
Recorded: 2022-06-28
Pages: 5
Assignors
CHIEN, HUNG-CHANG
Executed: 2022-05-30
LIN, JUNG-I
Executed: 2022-05-23
HSU, MING-CHIEH
Executed: 2022-05-30
HUANG, KUAN-CHIEH
Executed: 2022-05-23
WANG, TZU-JUI
Executed: 2022-05-22
HUANG, SHIH-MIN
Executed: 2022-05-23
WANG, CHEN-JONG
Executed: 2022-05-23
YAUNG, DUN-NIAN
Executed: 2022-06-13
CHU, YI-SHIN
Executed: 2022-05-22
CHEN, HSIANG-LIN
Executed: 2022-05-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Including Germanium Region Disposed in Semiconductor Substrate