Patent Assignment
Reel/Frame 060361/0243
Assignment of Assignor's Interest
Recorded: 2022-06-30
Pages: 3
Assignors
NIAN, JUN-NAN
Executed: 2022-06-16
LIANG, YAO-HSIANG
Executed: 2022-06-16
TUNG, JU PO
Executed: 2022-06-06
LIU, CHIEH-MIN
Executed: 2022-06-06
CHUNG, MING-CHING
Executed: 2022-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure Including Multiple Barrier Layers and Method for Forming the Same