Patent Assignment
Reel/Frame 060373/0246
Assignment of Assignor's Interest
Recorded: 2022-06-30
Pages: 18
Assignors
ZOU, ZHIHUA
Executed: 2022-06-09
KARHADE, OMKAR
Executed: 2022-06-08
ZHANG, BOTAO
Executed: 2022-06-23
CHIU, JULIA
Executed: 2022-06-13
CHIDAMBARAM, VIVEK
Executed: 2022-06-16
SHI, YI
Executed: 2022-06-08
BHATIA, MOHIT
Executed: 2022-06-24
AGHAZADEH, MOSTAFA
Executed: 2022-06-12
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Substrate Trench for Improved Hybrid Bonding
Application:
17/854,813 →
Publication:
US 2024/0006358