Patent Assignment
Reel/Frame 060389/0668
Assignment of Assignor's Interest
Recorded: 2022-05-27
Pages: 7
Assignors
OH, DONGJOON
Executed: 2022-04-13
KANG, UNBYOUNG
Executed: 2022-04-18
KIM, BYEONGCHAN
Executed: 2022-04-18
PARK, JUMYONG
Executed: 2022-04-13
SONG, SOLJI
Executed: 2022-04-13
LEE, CHUNGSUN
Executed: 2022-04-13
HWANG, HYUNSU
Executed: 2022-04-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same