Patent Assignment
Reel/Frame 060400/0969
Assignment of Assignor's Interest
Recorded: 2022-07-05
Pages: 4
Assignors
WU, CHIA CHUN
Executed: 2022-06-28
CHEN, CHIH-LIANG
Executed: 2022-06-28
ZHUANG, HUI-ZHONG
Executed: 2022-06-28
KAO, JERRY CHANG JUI
Executed: 2022-06-28
CHIEN, YUNG-CHEN
Executed: 2022-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming the Same