Patent Assignment
Reel/Frame 060406/0425
Assignment of Assignor's Interest
Recorded: 2022-07-06
Pages: 5
Assignors
LEE, BI-SHEN
Executed: 2022-05-24
TRINH, HAI-DANG
Executed: 2022-05-24
KUANG, HSUN-CHUNG
Executed: 2022-06-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same