Patent Assignment
Reel/Frame 060409/0470
Assignment of Assignor's Interest
Recorded: 2022-07-06
Pages: 4
Assignors
HAN, FENG
Executed: 2020-06-10
SHI, LEI
Executed: 2020-07-01
TSAI, HUNG-CHIH
Executed: 2020-06-22
SU, LIANG-YU
Executed: 2020-06-22
FAN, HANG
Executed: 2020-06-10
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
TSMC CHINA COMPANY LIMITED
4000, WEN XIANG ROAD, SONGJIANG, SHANGHAI, CHINA
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof