Assignment of Assignor's Interest

Recorded: 2022-07-06 Pages: 14

Assignors

WADA, HIDEO

Executed: 2022-04-26

YAMASAKI, HIROYUKI

Executed: 2022-04-25

SONODA, MASAHISA

Executed: 2022-04-22

OIKE, GO

Executed: 2022-07-01

Assignee

KIOXIA CORPORATION

1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Semiconductor Device with Improved Dicing Region for Reduced Peeling Defects

Application: 17/686,108 →

Publication: US 2023/0082971