Patent Assignment
Reel/Frame 060418/0263
Assignment of Assignor's Interest
Recorded: 2022-07-01
Pages: 4
Assignors
WANG, SHENG-TSUNG
Executed: 2022-06-15
SU, HUAN-CHIEH
Executed: 2022-06-15
CHEN, CHUN-YUAN
Executed: 2022-06-15
HUANG, LIN-YU
Executed: 2022-06-16
LU, MIN-HSUAN
Executed: 2022-06-15
WANG, CHIH-HAO
Executed: 2022-06-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device