Patent Assignment
Reel/Frame 060422/0283
Assignment of Assignor's Interest
Recorded: 2022-07-01
Pages: 4
Assignors
CHEN, SHING-CHAO
Executed: 2016-09-23
LIN, CHIH-WEI
Executed: 2016-09-23
CHIANG, TSUNG-HSIEN
Executed: 2016-09-23
CHENG, MING-DA
Executed: 2016-09-23
HSIEH, CHING-HUA
Executed: 2016-09-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Fan-Out Feature