Patent Assignment
Reel/Frame 060428/0039
Assignment of Assignor's Interest
Recorded: 2022-07-07
Pages: 4
Assignors
TSAI, SHIN-HUNG
Executed: 2022-07-06
HOU, CHENG-HAO
Executed: 2022-07-06
LAI, TE-YANG
Executed: 2022-07-06
LEE, DA-YUAN
Executed: 2022-07-06
CHUI, CHI ON
Executed: 2022-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Forming the Same
Application:
17/811,105 →
Publication:
US 2023/0343818