Patent Assignment
Reel/Frame 060428/0043
Assignment of Assignor's Interest
Recorded: 2022-07-07
Pages: 4
Assignors
KUO, HUNG-YI
Executed: 2022-06-23
YU, CHEN-HUA
Executed: 2022-06-23
YEE, KUO-CHUNG
Executed: 2022-06-20
HSIEH, CHENG-CHIEH
Executed: 2022-06-20
LEE, CHUNG-JU
Executed: 2022-06-20
LU, SZU-WEI
Executed: 2022-07-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package with Improved Heat Dissipation Efficiency and Method for Forming the Same