Patent Assignment
Reel/Frame 060433/0341
Assignment of Assignor's Interest
Recorded: 2022-07-07
Pages: 4
Assignors
WU, CHUNG-JUNG
Executed: 2022-06-16
HSIAO, SHENG-TSUNG
Executed: 2022-06-13
WANG, JEN YU
Executed: 2022-06-23
SHAO, TUNG-LIANG
Executed: 2022-06-30
TUNG, CHIH-HANG
Executed: 2022-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Cooling Cover and Packaged Semiconductor Device Including the Same
Application:
17/809,128 →
Publication:
US 2023/0420337