Patent Assignment
Reel/Frame 060434/0240
Assignment of Assignor's Interest
Recorded: 2022-07-07
Pages: 4
Assignors
CHANG, FONG-YUAN
Executed: 2022-07-07
YU, HO CHE
Executed: 2022-03-01
CHEN, YU-HAO
Executed: 2022-03-01
LU, YII-CHIAN
Executed: 2022-03-22
LIN, CHING-YI
Executed: 2022-03-08
LEE, JYH CHWEN FRANK
Executed: 2022-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure with Integrated Passive Device Having Opposed Solder Bumps
Application:
17/824,330 →
Publication:
US 2023/0387078