Patent Assignment
Reel/Frame 060452/0533
Assignment of Assignor's Interest
Recorded: 2022-07-07
Pages: 5
Assignors
LAI, CHIH-YU
Executed: 2022-07-02
CHEN, CHIH-LIANG
Executed: 2022-03-14
LU, CHI-YU
Executed: 2022-03-10
WANG, CHUNG-HSING
Executed: 2022-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Including Through via and Method of Making
Application:
17/727,504 →
Publication:
US 2023/0343703