Patent Assignment
Reel/Frame 060459/0516
Assignment of Assignor's Interest
Recorded: 2022-07-08
Pages: 7
Assignors
JANG, WOO SEONG
Executed: 2022-07-01
PARK, WON JI
Executed: 2022-06-30
AHN, JEONG HOON
Executed: 2022-07-06
OH, JAE HEE
Executed: 2022-07-06
KIM, JI HYUNG
Executed: 2022-06-30
DING, SHAOFENG
Executed: 2022-06-30
HONG, SEOK JUN
Executed: 2022-06-30
HWANG, JE GWAN
Executed: 2022-06-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interposer Structure and Semiconductor Package Including the Same
Application:
17/811,342 →
Publication:
US 2023/0170289