Patent Assignment
Reel/Frame 060459/0633
Assignment of Assignor's Interest
Recorded: 2022-07-08
Pages: 4
Assignors
HUANG, HUI-MIN
Executed: 2022-05-02
ZHAN, KAI JUN
Executed: 2022-05-02
WU, YI CHEN
Executed: 2022-07-08
LIN, WEI-HUNG
Executed: 2022-05-02
CHENG, MING-DA
Executed: 2022-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Systems for Fluxless Bonding Using an Atmospheric Pressure Plasma and Methods for Performing the Same