Patent Assignment
Reel/Frame 060467/0730
Assignment of Assignor's Interest
Recorded: 2022-07-10
Pages: 4
Assignors
HSIUNG, TE-CHIH
Executed: 2022-06-26
WANG, YI-CHEN
Executed: 2022-06-26
CHENG, GUANG-HONG
Executed: 2022-06-30
WANG, WEN
Executed: 2022-07-03
TU, YUAN-TIEN
Executed: 2022-07-03
LIN, HUAN-JUST
Executed: 2022-07-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dielectric Cap Structure in Semiconductor Devices and Methods of Manufacturing the Same