Assignment of Assignor's Interest

Recorded: 2022-07-11 Pages: 6

Assignors

HWANG, HYEONJEONG

Executed: 2022-04-06

KIM, MINJUNG

Executed: 2022-04-06

KIM, JONGYOUN

Executed: 2022-04-06

LEE, SEOKHYUN

Executed: 2022-04-06

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Packages Having Conductive Patterns Including Wiring Patterns and Under-Bump Patterns, and Methods of Fabricating the Same

Application: 17/846,777 →

Publication: US 2023/0109448