Patent Assignment
Reel/Frame 060484/0893
Assignment of Assignor's Interest
Recorded: 2022-07-12
Pages: 6
Assignors
OH, HEUNGSUK
Executed: 2022-06-23
HAN, KYU-BIN
Executed: 2022-06-23
KIM, SANGWOOK
Executed: 2022-06-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Device