Patent Assignment
Reel/Frame 060488/0214
Assignment of Assignor's Interest
Recorded: 2022-07-12
Pages: 4
Assignors
YEN, HUNG-YU
Executed: 2022-06-20
YEH, WEI-TING
Executed: 2022-06-20
CHEN, KO-FENG
Executed: 2022-06-20
LIN, KENG-CHU
Executed: 2022-06-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having Isolation Structure to Reduce Current Leakage
Application:
17/824,669 →
Publication:
US 2023/0387312