Patent Assignment
Reel/Frame 060490/0687
Assignment of Assignor's Interest
Recorded: 2022-07-13
Pages: 6
Assignors
KIM, BYUNG WOOK
Executed: 2022-05-27
KIM, A-YOUNG
Executed: 2022-05-27
JEONG, SEONG WON
Executed: 2022-05-27
HA, SANG SU
Executed: 2022-05-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof