Patent Assignment
Reel/Frame 060497/0687
Assignment of Assignor's Interest
Recorded: 2022-07-13
Pages: 6
Assignors
OLSON, TIMOTHY L.
Executed: 2021-07-20
SANDSTROM, CLIFFORD
Executed: 2021-07-21
BISHOP, CRAIG
Executed: 2021-07-20
DAVIS, ROBIN
Executed: 2021-07-06
Assignee
DECA TECHNOLOGIES USA, INC.
7855 SOUTH RIVER PARKWAY, STE. 205, TEMPE, ARIZONA, 85284
Covered Property
(1)
Stackable Fully Molded Semiconductor Structure with Through Silicon via (Tsv) Vertical Interconnects