Patent Assignment
Reel/Frame 060498/0898
Assignment of Assignor's Interest
Recorded: 2022-07-13
Pages: 4
Assignors
KIM, CHANGOH
Executed: 2022-07-13
JUNG, JINHEE, `
Executed: 2022-07-13
KWON, OMIN
Executed: 2022-07-13
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming EMI Shielding Material in Two-Step Process to Avoid Contaminating Electrical Connector