Patent Assignment
Reel/Frame 060506/0004
Assignment of Assignor's Interest
Recorded: 2022-07-14
Pages: 7
Assignors
YOON, YAE JUNG
Executed: 2022-05-03
KIM, EUNG KYU
Executed: 2022-05-03
BAE, MIN JUN
Executed: 2022-05-03
SUK, KYOUNG LIM
Executed: 2022-05-03
LEE, SEOK HYUN
Executed: 2022-05-07
JANG, JAE GWON
Executed: 2022-05-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Connecting Pads
Application:
17/853,205 →
Publication:
US 2023/0068587