Patent Assignment
Reel/Frame 060517/0626
Assignment of Assignor's Interest
Recorded: 2022-06-16
Pages: 7
Assignors
JEONG, SEONGHA
Executed: 2022-05-13
KIM, KYUNG-SUN
Executed: 2022-05-18
KIM, DONGWAN
Executed: 2022-05-18
NA, DONGHYEON
Executed: 2022-05-18
SUNG, DOUGYONG
Executed: 2022-05-20
SHIN, MYEONGSOO
Executed: 2022-05-18
JUNG, UNGYO
Executed: 2022-05-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chuck Assembly, Fabrication System Therewith, and Method of Fabricating Semiconductor Device Using the Same