Patent Assignment
Reel/Frame 060521/0181
Assignment of Assignor's Interest
Recorded: 2022-07-15
Pages: 4
Assignors
YEH, TING-YU
Executed: 2022-07-14
HUANG, HAN-HSIANG
Executed: 2022-07-14
WEN, CHUN-HSIEN
Executed: 2022-07-14
CHANG, CHIH-WEI
Executed: 2022-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Power Delivery Structures and Methods of Manufacturing Thereof