Patent Assignment
Reel/Frame 060523/0907
Assignment of Assignor's Interest
Recorded: 2022-07-15
Pages: 4
Assignors
CHANG, JUNG-HUNG
Executed: 2022-06-22
LIN, ZHI-CHANG
Executed: 2022-06-22
CHEN, SHIH-CHENG
Executed: 2022-07-03
CHUANG, TSUNG-HAN
Executed: 2022-06-22
CHIANG, KUO-CHENG
Executed: 2022-06-22
WANG, CHIH-HAO
Executed: 2022-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit with Bottom Dielectric Insulators and Fin Sidewall Spacers for Reducing Source/Drain Leakage Currents