Assignment of Assignor's Interest

Recorded: 2022-07-18 Pages: 4

Assignors

YANG, INBUM

Executed: 2022-06-29

RHO, JUNGHUN

Executed: 2022-06-27

JUNG, SANGSIK

Executed: 2022-06-30

CHOI, BONGWOON

Executed: 2022-06-27

Assignee

LG ELECTRONICS INC.

128, YEOUI-DAERO, YEONGDEUNGPO-GU, SEOUL, 07336, KOREA, REPUBLIC OF

Covered Property (1)

Chip Transferring Apparatus for Self-Assembly and Method for Supplying Semiconductor Light Emitting Diode

Application: 17/793,244 →

Publication: US 2023/0061671