Patent Assignment
Reel/Frame 060534/0920
Assignment of Assignor's Interest
Recorded: 2022-07-18
Pages: 6
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Boundary Design to Reduce Memory Array Edge Cmp Dishing Effect