Patent Assignment
Reel/Frame 060537/0616
Assignment of Assignor's Interest
Recorded: 2022-07-18
Pages: 7
Assignors
CHAI, SEUNGIL
Executed: 2022-06-08
SHIN, KYUNGHEE
Executed: 2022-06-08
LEE, DAEHEE
Executed: 2022-06-08
LEE, MOONHUI
Executed: 2022-06-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Layout Method of the Same