Patent Assignment
Reel/Frame 060544/0001
Assignment of Assignor's Interest
Recorded: 2022-07-19
Pages: 10
Assignors
HUNG, FENG-CHI
Executed: 2019-12-24
YAUNG, DUN-NIAN
Executed: 2019-12-15
LIU, JEN-CHENG
Executed: 2019-12-24
WU, WEI CHUANG
Executed: 2019-12-24
CHEN, YEN-YU
Executed: 2019-12-24
YU, CHIH-KUAN
Executed: 2019-12-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Image Sensor with Overlap of Backside Trench Isolation Structure and Vertical Transfer Gate