Patent Assignment
Reel/Frame 060545/0090
Assignment of Assignor's Interest
Recorded: 2022-07-19
Pages: 3
Assignors
HUANG, SUNG-JU
Executed: 2022-07-16
CHENG, KUANG-WEI
Executed: 2022-07-18
WANG, YEH-CHIEH
Executed: 2022-07-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Exhaust Manifold for Semiconductor Process Chamber