Patent Assignment
Reel/Frame 060545/0738
Assignment of Assignor's Interest
Recorded: 2022-07-19
Pages: 8
Assignors
CARNEY, FRANCIS J.
Executed: 2020-05-18
CHEW, CHEE HIONG
Executed: 2020-05-12
WANG, SOON WEI
Executed: 2020-05-12
KUROSE, EIJI
Executed: 2020-05-13
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Packages with Die Support Structure for Thin Die
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →