Patent Assignment
Reel/Frame 064123/0001
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655
Recorded: 2023-06-23
Pages: 430
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-06-22
Assignees
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(76)
Wide Voltage Range Level Shifter Circuit
Digital Communications Bus Suitable for Automotive Applications
Spad-Based Devices with Transistor Stacking
Application:
17/811,149 →
Publication:
US 2024/0014242
Diodes with Schottky Contact Including Localized Surface Regions
Die Sidewall Coatings and Related Methods
Semiconductor Packages with Die Support Structure for Thin Die
Multidie Supports and Related Methods
Dual Side Cooled Power Module with Three-Dimensional Direct Bonded Metal Substrates
Led Driver Suitable for Low-Voltage Operation and Method Therefor
Image Sensors Having High Dynamic Range Imaging Pixels
Silicon Photomultipliers with Split Microcells
Stacked Chip Scale Optical Sensor Package
Application:
17/813,972 →
Publication:
US 2024/0030265
Heterogeneous Embedded Power Device Package Using Dam and Fill
Application:
17/814,566 →
Publication:
US 2024/0030208
Power Device Including Metal Layer
Application:
17/814,750 →
Publication:
US 2022/0359426
Direct Substrate-Side Cooling in Power Device Module
Application:
17/814,949 →
Publication:
US 2024/0038632
Monitoring Temperature Per Phase in a Multiphase Power Stage
Addressing Multiphase Power Stage Modules for Power State and Thermal Management
Substrate Structures and Methods of Manufacture
Stitched Integrated Circuit Dies
Multichip Module Supports and Related Methods
Application:
17/816,450 →
Publication:
US 2022/0367305
Substrate Structures and Methods of Manufacture
Application:
17/816,455 →
Publication:
US 2022/0375833
Image Sensor Package Having a Light Blocking Member
Dynamic Antenna Tuning Apparatus and Method
Self Clocked Low Power Doubling Charge Pump
Power Circuit Module
Imaging Systems with Adjustable Amplifier Circuitry
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Application:
17/818,880 →
Publication:
US 2024/0055503
Adjustable Clamp Finger Design
Apparatus and Methods for Producing Stable Clock Signals Based on a Varying Frequency Source Clock
Sensor Readout Circuit and Method
Application:
17/820,960 →
Publication:
US 2023/0284926
Methods and Apparatus for an Image Sensor
Motion-Compensated Distance Sensing with Concurrent Up-Chirp Down-Chirp Waveforms
Battery Hazard Detection
Application:
17/821,986 →
Publication:
US 2024/0069112
Methods of Manufacturing Semiconductor Devices and Semiconductor Devices
Cyclic Redundancy Check (Crc) Generation
Image Sensor Ball Grid Array Package
Application:
17/822,403 →
Publication:
US 2023/0064356
Sidewall Protected Image Sensor Package
Application:
17/822,405 →
Publication:
US 2023/0063200
Inductive Angular Position Sensor
Power Module Package for Direct Cooling Multiple Power Modules
Synchronous Rectification Control in Llc Topology
Low Stress Asymmetric Dual Side Module
Low Stress Asymmetric Dual Side Module
Termination of Wireless Transmission of a Data Frame
Methods and Structures for Contacting Shield Conductor in a Semiconductor Device
Low Stress Asymmetric Dual Side Module
Low Stress Asymmetric Dual Side Module
Systems and Methods for Designing a Module Semiconductor Product
Systems and Methods for Designing a Discrete Device Product
Image Sensor Packages and Related Methods
Application:
17/930,111 →
Publication:
US 2022/0415943
Leadframe Mounting with Lead Insertion for Lead Wall Bonding
Application:
17/931,651 →
Publication:
US 2024/0090130
Power Module Package with Stacked Direct Bonded Metal Substrates
Low-Latency Communication Protocol for Binaural Applications
Sic Mosfet with Built-in Schottky Diode
Application:
17/931,770 →
Publication:
US 2023/0055024
Slew-Rate Boost Circuitry
Bootstrap Clamp Circuit and Method
Bandgap Circuit with Noise Reduction and Temperature Stability
Top Cool Discrete Package
Application:
63/368,202 →
Method of Forming a Photosensitive Module Including a Through Silicon via (Tsv) Structure
Application:
63/368,745 →
Photosensitive Packaging Structure
Application:
63/368,832 →
Power Module Semiconductor Package
Application:
63/369,004 →
BSI CFA uLens Process and Structure
Application:
63/369,684 →
Isolated Drain 45V nLDMOS For Next Gen 65BCD_MV in EFK
Application:
63/370,312 →
Power Module with Jet Impingement Cooling
Application:
63/370,389 →
Electronic Device and Method of Interconnection of Top and Bottom
Application:
63/370,859 →
Robust Sealing Method for Direct Liquid Cooling Power Modules
Application:
63/371,700 →
Bandgap Circuit
Application:
63/373,244 →
Fast Short Current Detection
Application:
63/373,892 →
Ground Fault Circuit Interrupter with Scalable Threshold Over a Range of Frequency
Application:
63/374,990 →
Termination Structures for Mosfets
Application:
63/375,072 →
Termination Structures for Mosfets
Application:
63/375,073 →
Adaptive Multi-Input Multi-Output with Multi-Link Operation
Application:
63/376,323 →
Station Adaptive Ranging
Application:
63/376,324 →
Latency-Based Contention
Application:
63/376,325 →
Stacked Quantum Dot Short Wave Infrared Sensor
Application:
63/377,120 →
SiPM having sub-pixel design with routing flexibility
Application:
63/377,925 →
Fast Device Reinitialization on DSI3 Bus
Application:
63/399,311 →
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 5, 2022
From: HEUBI, ALEXANDER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060400/0735 →
Assignment of Assignor's Interest
Jul 6, 2022
From: EGGERMONT, JEAN-PAUL ANNA JOSEPH; VORENHOLT, JOHANNES; HUS, PETER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060415/0522 →
Assignment of Assignor's Interest
Jul 7, 2022
From: LEDVINA, JAN; PALUBIAK, DARIUSZ PIOTR
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060430/0268 →
Assignment of Assignor's Interest
Jul 11, 2022
From: BOLOTNIKOV, ALEXANDER VIKTOROVICH; ALLERSTAM, FREDRIK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060469/0839 →
Assignment of Assignor's Interest
Jul 19, 2022
From: BRAS, SEBASTIEN; PLOJHAR, JAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060548/0901 →
Assignment of Assignor's Interest
Jul 19, 2022
From: SEDDON, MICHAEL J.; CARNEY, FRANCIS J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060547/0030 →
Assignment of Assignor's Interest
Jul 19, 2022
From: LIU, YONG; LIN, YUSHENG; TEYSSEYRE, JEROME
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060547/0917 →
Assignment of Assignor's Interest
Jul 19, 2022
From: CARNEY, FRANCIS J.; LIN, YUSHENG; SEDDON, MICHAEL J.; CHEW, CHEE HIONG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060545/0093 →
Assignment of Assignor's Interest
Jul 19, 2022
From: CARNEY, FRANCIS J.; CHEW, CHEE HIONG; WANG, SOON WEI; KUROSE, EIJI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060545/0738 →
Assignment of Assignor's Interest
Jul 20, 2022
From: MCGARVEY, BRIAN PATRICK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060570/0704 →
Assignment of Assignor's Interest
Jul 20, 2022
From: JOHNSON, RICHARD SCOTT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060570/0688 →
Assignment of Assignor's Interest
Jul 21, 2022
From: WU, WENG-JIN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060577/0482 →
Assignment of Assignor's Interest
Jul 25, 2022
From: KRISHNAN, SHUTESH; CHEW, CHEE HIONG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060603/0401 →
Assignment of Assignor's Interest
Jul 26, 2022
From: PRAJUCKAMOL, ATAPOL; CHEW, CHEE HIONG; YAO, YUSHUANG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060623/0875 →
Assignment of Assignor's Interest
Jul 29, 2022
From: ZOU, HAN; CREGG, OWEN; SPILLANE, MARGARET; HARRIMAN, PAUL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060668/0071 →
Assignment of Assignor's Interest
Jul 29, 2022
From: COWLEY, NICHOLAS PAUL; TALBOT, ANDREW DAVID
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060675/0553 →
Assignment of Assignor's Interest
Jul 29, 2022
From: SPILLANE, MARGARET; KELLIHER, KEVIN; CREGG, OWEN; HARRIMAN, PAUL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060667/0901 →
Assignment of Assignor's Interest
Jul 29, 2022
From: LIN, YUSHENG; TAKAKUSAKI, SADAMICHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 060673/0394 →
Security Interest
Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →
Assignment of Assignor's Interest
Dec 4, 2025
From: LEE, BONGYONG; KANG, BOHEE; CHOI, DOOJIN; PARK, KYEONGSEOK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 073119/0407 →