Patent Assignment
Reel/Frame 073119/0407
Assignment of Assignor's Interest
Recorded: 2025-12-04
Pages: 9
Assignors
LEE, BONGYONG
Executed: 2019-11-19
KANG, BOHEE
Executed: 2019-12-13
CHOI, DOOJIN
Executed: 2019-11-19
PARK, KYEONGSEOK
Executed: 2019-11-19
NEYER, THOMAS
Executed: 2019-12-09
YANG, JEONGWOO
Executed: 2019-11-19
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Power Device Including Metal Layer
Application:
17/814,750 →
Publication:
US 2022/0359426
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →