Power module package for direct cooling multiple power modules
According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.
1. A method of assembly a power module package integrating multiple power modules, the method comprising:
receiving a module carrier, the module carrier including a first region defining a first heat-sink slot and a second region defining a second heat-sink slot;
applying an adhesive material to the first region and the second region;
inserting a first heat sink coupled to a first power module through the first heat-sink slot until the first power module contacts the adhesive material; and
inserting a second heat sink coupled to a second power module through the second heat-sink slot until the second power module contacts the adhesive material.
2. The method of claim 1 , further comprising:
applying heat to the adhesive material.
3. The method of claim 1 , further comprising:
coupling a housing to the module carrier; and
positioning a ring member between the module carrier and the housing.
4. The method of claim 3 , wherein the housing is coupled to the module carrier via one or more fasteners.
5. The method of claim 1 , wherein the first region includes a protrusion that extends from a surface of the module carrier, the method further comprising:
inserting the protrusion into a slot defined by the first power module.
6. The method of claim 1 , wherein the module carrier includes a third region defining a third heat-sink slot, the method further comprising:
applying the adhesive material to the third region; and
inserting a third heat sink coupled to a third power module through the third heat-sink slot until the third power module contacts the adhesive material on the third region.
7. The method of claim 6 , wherein each of the first power module, the second power module, and the third power module correspond to a separate phase of a three phase current of an inverter.
8. The method of claim 6 , further comprising:
positioning a ring member between the module carrier and a housing, the ring member extending around the first power module, the second power module, and the third power module, collectively.
9. The method of claim 1 , wherein the first region includes a slot that extends into a portion of the module carrier, the method further comprising:
in response to applying the adhesive material to the first region, receiving a portion of the adhesive material in the slot.
10. The method of claim 1 , wherein the first power module includes a half-bridge module.
11. A method of assembly a power module package integrating multiple power modules, the method comprising:
receiving a module carrier, the module carrier including a first region defining a first heat-sink slot and a second region defining a second heat-sink slot;
inserting a first heat sink into the first heat-sink slot;
inserting a second heat sink into the second heat-sink slot;
applying an adhesive material to the first region, the second region, the first heat sink, and the second heat sink;
contacting a first power module to the adhesive material on the first region and the first heat sink; and
contacting a second power module to the adhesive material on the second region and the second heat sink.
12. The method of claim 11 , further comprising:
applying heat to the adhesive material.
13. The method of claim 11 , further comprising:
coupling a housing to the module carrier; and
positioning a ring member between the module carrier and the housing.
14. The method of claim 13 , wherein the housing is coupled to the module carrier via one or more fasteners.
15. The method of claim 11 , wherein the first region includes a protrusion that extends from a surface of the module carrier, the method further comprising:
inserting the protrusion into a slot defined by the first power module.
16. The method of claim 11 , wherein the module carrier includes a third region defining a third heat-sink slot, the method further comprising:
inserting a third heat sink into the third heat-sink slot;
applying the adhesive material to the third region and the third heat sink;
contacting a third power module to the adhesive material on the third region and the third heat sink.
17. The method of claim 16 , wherein each of the first power module, the second power module, and the third power module correspond to a separate phase of a three phase current of an inverter.
18. The method of claim 16 , further comprising:
positioning a ring member between the module carrier and a housing, the ring member extending around the first power module, the second power module, and the third power module, collectively.
19. The method of claim 11 , wherein the first region includes a slot that extends into a portion of the module carrier, the method further comprising:
in response to applying the adhesive material to the first region, receiving a portion of the adhesive material in the slot.
20. The method of claim 11 , wherein each of the first heat sink and the second heat sink includes a pin fin heat sink.